Micro Circuits & PCB Technologies
- Generic EDAC (EDAC) IP core. 423 KB
- MIL-STD-1553B Simple Remote Terminal (1553SRT) IP core. 429 KB
- MIL-STD-1553B Enhanced Remote Terminal (1553ERT) IP core. 417 KB
- Metal core multilayer PCB Technology for thermal management. 460 KB
- Rigid-flex multilayer PCB Technology. 606 KB
- Fine line PCB Technology for Fine-pitch surface mount devices. 409 KB
- Fine-via PCB Technology for high-pin count FPGA devices. 479 KB
- Thermal Management in Space Electronics with externally bonded Heat sinks. 500 KB
- Plasma Enhanced Desmearing - Etch Back and Activation process for Plated through Hole (PTH) realization in Printed Wiring Boards (PWBs). 740 KB
- Fine Via Filling and Copper Cap Plating Process for Printed Wiring Boards (PWBs). 377 KB
- Chemical Process for Decapsulation of Electronic Components. 503 KB
- Fabrication technology for Gas electron Multipliers. 517 KB
- Chemical Formulation of Stable, Low build Electroless Copper Concentrate for High Reliability Plated through Hole Interconnections. 432 KB